CNC machining for electronics and semiconductor equipment: equipment fixtures, vacuum-interface parts, cooling plates and precision mounts. Define datum stability, cleanliness, burr control and finish compatibility before selecting the machining and inspection route.

Applications

What we make for electronic & semiconductor

Wafer-handling gripper body in stainless

Wafer-Handling & Vacuum Chambers

For wafer handling and vacuum hardware, we focus on sealing surfaces, particle-sensitive details, cleaning expectations and safe handling of thin sections. Equipment parts frequently sit between process conditions and sensitive devices. Material, cleanliness, sealing and locating expectations should be agreed before the machining route is fixed.

Before release, confirm the primary datum scheme and the interfaces that transfer load or positioning into the next assembly.

Precision optics mount and kinematic base

Optics & Test Fixtures

For optical and test fixtures, we review stable locating datums, flatness-critical interfaces, adjustment travel and thermal effects on alignment. Equipment parts frequently sit between process conditions and sensitive devices. Material, cleanliness, sealing and locating expectations should be agreed before the machining route is fixed.

The operating environment is converted into a practical review of materials, surfaces, sealing and handling before the route is released.

Process Gas & Fluid Handling

For gas and fluid parts, we coordinate port standards, thread engagement, sealing features, flow paths and agreed leak-test preparation. Equipment parts frequently sit between process conditions and sensitive devices. Material, cleanliness, sealing and locating expectations should be agreed before the machining route is fixed.

We identify the features that must align with adjacent electronics, fixtures or enclosures and define how they will be checked.

PCB assembly precision jigs and stencil frames

PCB Assembly Equipment

For PCB assembly equipment, we align board locators, pin positions, operator access and changeover features with the intended production flow. Equipment parts frequently sit between process conditions and sensitive devices. Material, cleanliness, sealing and locating expectations should be agreed before the machining route is fixed.

The review also covers installation access, tolerance build-up and the dimensions most likely to affect field assembly.

Semiconductor Packaging

For packaging hardware, we review thermal paths, planarity-sensitive contact areas, material compatibility and assembly sequence constraints. Equipment parts frequently sit between process conditions and sensitive devices. Material, cleanliness, sealing and locating expectations should be agreed before the machining route is fixed.

We agree which contact areas, interfaces and visible surfaces need focused process control and order-specific inspection evidence.

Probe Card & Test Hardware

For probe-card and test hardware, we focus on probe access, fixture alignment, repeatable registration and replaceable wear interfaces. Equipment parts frequently sit between process conditions and sensitive devices. Material, cleanliness, sealing and locating expectations should be agreed before the machining route is fixed.

The final review links the critical geometry to a workable machining sequence, measurement approach and delivery documentation scope.

How we work

Materials, tolerances, collaboration

Which components can be reviewed?

Tecpreva reviews revision-controlled drawings for equipment fixtures, vacuum-interface parts, cooling plates and precision mounts. Geometry, material, volume and acceptance criteria determine project suitability; the industry label alone is not a qualification.

Material and finish selection

Consider aluminum, stainless steel and engineering plastics according to temperature, cleanliness and electrical requirements. Specify the exact grade, condition, finish standard, coating thickness and protected surfaces. Do not substitute a material or change a functional surface without approval.

What should the RFQ include?

Send the 2D drawing and STEP model, revision, quantities, critical features, destination and inspection plan. For this application, focus on datum stability, cleanliness, burr control and finish compatibility. Identify any special testing, cleanliness or customer documentation requirements separately.

How is sample-to-production consistency controlled?

Agree the first-article acceptance process, datum strategy, inspection coverage and batch identification. Use approved drawings and samples as controlled references. Confirm any certification, regulatory, leak-test or performance-test requirement before accepting the order.

Drawing review

Discuss Electronic & Semiconductor machining requirements

Send the current drawing revision, STEP model, material grade, quantity and inspection scope. Engineering sends an initial response within one business day and confirms manufacturing assumptions after drawing review.

Request a manufacturing review

Plan precision hardware around cleanliness, alignment and serviceability.